Abstract— Driving the transition to LED from the premium car segment with highly sophisticated and customized designs towards economic car segment is one of the key challenges of the automotive lighting industry. Wafer Leveling Packaging (WLP) as the building blocks of next generation high power frontlighting LEDs enables high performance front lighting applications for both premium and mainstream segments. Single die packaging based on WLP provides high-contrast, small light emitting area (LEA) LEDs at competitive flux levels, high-packing density and high thermal efficiency, they are well suited for dynamic headlamp functionalities such as a Matrix light and Adaptive Driving Beam (ADB). In mainstream applications multi-die WLP packaging allows for design of compact and stylish LED headlamps with high performance and reduced system complexity. As the smart building blocks of frontlighting LED sources, WLP could accelerate the development of automotive LED headlamps in an attractive and cost effective way.

Keywords: LED, Frontlighting, WLP, ADB, LEA